A gathering of all types of products, technologies and services that contribute to the miniaturization and thinning of cutting-edge devices such as semiconductors, LED, power devices, sensors and MEMS. *Exhibitor and visitor totals are for ELECTRONIC COMPONENTS & MATERIALS EXPO, ELECTROTEST JAPAN, FINE PROCESS TECHNOLOGY EXPO, IC & Sensor Packaging Technology Expo, INTERNEPCON JAPAN and PWB Expo combined.

Wearable Device & Technology Expo is an international B2B exhibition for wearable devices and their development technologies including IoT and AR/VR technologies.

Exhibition featuring all varieties of test, inspection and measurement systems for SMT, IC packaging and board manufacturing. *Exhibitor and visitor totals are for ELECTRONIC COMPONENTS & MATERIALS EXPO, ELECTROTEST JAPAN, FINE PROCESS TECHNOLOGY EXPO, IC & Sensor Packaging Technology Expo, INTERNEPCON JAPAN and PWB Expo combined.